Qualcomm's next-generation flagship chip will be launched in two versions (SM8950 and SM8975), both using TSMC's N2P process. MediaTek's Dimensity 9600, on the other hand, will enter the market with a single version strategy, precisely positioned between Qualcomm's two chips. Although the Dimensity 9600 continues the ARM architecture, its performance in competing with Qualcomm's third-generation self-developed Orion CPU is a key focus.
According to interactive information, Qualcomm's high-end version will support LPDDR6 memory, and the model adjustments (SM8950/8975 corresponding to the previous generation 8945/8950) suggest performance and positioning upgrades, aiming directly to "surpass the 8850." TSMC's accelerated N2P process production aims to seize the AI terminal market and may further intensify process technology competition.
This leak highlights three key aspects of the 2025 chip market: process upgrades (N2P), architecture showdown (ARM vs Oryon), and strategy differences (MediaTek single version vs Qualcomm dual versions). The Dimensity 9600's mid-range positioning may become a key variable influencing the high-end smartphone landscape.
